ASM Pacific Technology
ASM Pacific Technology is a world-renowned software company that specializes in providing advanced packaging solutions and equipment for the semiconductor and electronics industries. Founded in 1975, the Hong Kong-based company has since expanded its operations to other countries such as China, Japan, Korea, Singapore, and Malaysia, making it a global player in the industry. ASMPT has a reputation for developing cutting-edge technology in the areas of assembly and packaging, which enables manufacturers to improve their productivity and efficiency. The company strives to create innovative products that help customers stay ahead of the curve in an ever-changing technological landscape.
One of the critical strengths of ASM Pacific Technology is its commitment to research and development. The company invests heavily in R&D to ensure its products are at the forefront of technological innovation. This dedication to innovation has resulted in numerous breakthroughs, including developing the industry's first fully automated flip-chip bonder and the world's smallest high-speed die bonder.
Through continuous innovation and improvement, ASMPT has become a leader in the packaging and assembly equipment market, with a strong global presence and a customer base that spans across various industries.
Founded: 1975
Headquarters: Kwai Chung, New Territories, Hong Kong
Website: https://www.asmpt.com/
