SMIC

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Semiconductor Manufacturing International Corporation (SMIC) is one of China's most prominent semiconductor foundries and a key player in the global semiconductor industry. Founded in 2000, SMIC has rapidly grown to become one of the leading semiconductor manufacturing companies in China and is listed on both the Shanghai Stock Exchange and the Hong Kong Stock Exchange.

SMIC
specializes in providing integrated circuit (IC) manufacturing services, including design, manufacturing, and testing, to various customers worldwide. The company operates advanced semiconductor fabrication facilities, commonly known as fabs, in China, with its headquarters located in Shanghai.

One of SMIC's primary focuses is on advanced process technology development. Over the years, the company has made significant investments in research and development to keep up with the fast-paced and ever-evolving semiconductor industry. SMIC offers a range of process nodes, including 90nm, 65nm, 45nm, 28nm, and has been working on further advancements to meet the demand for cutting-edge chips.

Despite its impressive growth and technological capabilities, SMIC has faced challenges in the international market. It has encountered export restrictions and bans on certain technologies due to concerns related to national security and technology transfer. These issues have had an impact on the company's access to the most advanced semiconductor equipment and tools, potentially hindering its ability to compete with leading global foundries.


Founded: 2000

Headquarters: Shanghai, China

Website: https://www.smics.com/en/

Screenshot via https://www.smics.com/en/#section2
Screenshot via https://www.smics.com/en/#section2
Screenshot via https://www.smics.com/en/#section2
Screenshot via https://www.smics.com/en/#section2

Toplist Joint Stock Company
Address: 3rd floor, Viet Tower Building, No. 01 Thai Ha Street, Trung Liet Ward, Dong Da District, Hanoi City, Vietnam
Phone: +84369132468 - Tax code: 0108747679
Social network license number 370/GP-BTTTT issued by the Ministry of Information and Communications on September 9, 2019
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